TITLE OF THE CONFERENCES
CONFERENCES OF TUESDAY 9 OCTOBER 2018
Plastronics
« From plastronics to Mechatronic Integrated Device : news & trends »
Speaker : Amaury Veille, S2P-Smart Plastic Products
« (Smart) Plastic Valley : welcome to the "Cité de la Plastronique"»
Speaker : Sinaa Thabet, Haut-Bugey Agglomération
« Practical case : development and realisation of a GPS antenna in plastronics for sport market »
Speakers : Christophe Dupuis, Decathlon & Delphine Bechevet, Hepia Genève
« New generation of felxible sensors and actuators based on conductive silicone »
Speakers : Vincent Bert & Daniel Haefliger, Sateco AG
« Last evolutions of IME (In Mold Electronics) »
Speakers : Olivier Dassonville, Sintex NP
Cobotics - Electronics
« Cobotic and process applications : screwing, testing machines, ultrasound welding, …»
Speaker : Paul De Scorraille, MIP Robotics
« Future of electronics : evolutions and challenges »
Speaker : Jean-Pierre Villain, PC2A
CONFERENCES OF WEDNESDAY, OCTOBER 10, 2018
Printed electronics
« Introduction on printed electronics : presentations and evolution perspectives for French industry»
Speaker : Anne lise Marechal, AFELIM
« Structural electronics and green mobility »
Speaker : Emmanuelle Veran, CEA Liten
« RFID sensors et Flexibles Substrates: overview of the technologies for medical diagnosis, IoT et Food security applications»
Speaker : Brice Sorli, Université de Montpellier
Presentation soon available
Contact : brice.sorli@ies.univ-montp2.fr
« Printed Electronics on flexible support: presentation of the SPRINT Technology Platform and its inkjet printing process applications »
Speaker : Evangéline Bénevent, Université Aix-Marseille - Plateforme SPRINT
« ELORPrintTec, the facility for Open Innovation in Flexible Printed Electronics: a show case on sensors and actuators »
Speakers : Wiljan Smaal & Georges Hadziioannou, Université de Bordeaux / INP / CNRS
Plastronics
« From prototypes to the factory of the future : industrial applications and innovation provided by additive manufacturing »
Speaker : Gulay Bozoklu, Stratasys GmbH
« The Potential of 3D-MID Technology for Omnidirectional Inductive Wireless Power Transfer»
Speaker : Sergkei Kamotesov, S2P-Smart Plastic Products
« Innovative training in 3D plastronics in the University of Lyon »
Speaker : Philippe Lombard, Laboratoire Ampère - INSA de Lyon