MecaPlasTronic Connection 2022

Conf 16 | Henkel Solutions for Plastronics: example of Low Pressure Molding (LPM)

Nov 30, 2022 | 9:30 AM - 9:55 AM

Salle A

Description

As a global player in adhesives, sealants and functional coatings, Henkel develops a wide range of solutions for electronics, some of which are of particular interest to plastronics. Conductive adhesives help to reliably attach components to circuits. Conductive inks allow 2D or 3D circuits to be produced by additive manufacturing. Finally, TECHNOMELT® and LOCTITE® material solutions for low-pressure moulding protect electronic components from moisture, chemical exposure and high temperatures. The advantage of these products is their simplicity: the operation is low pressure, the cycle time is short and thin or fragile circuits are not damaged. For these reasons, TECHNOMELT® and LOCTITE® are regularly chosen as alternatives to encapsulation processes (e.g. potting) and conventional plastic housings.

Discover the session speaker(s)

TS

Thibaut SOULESTIN

HENKEL
Printed Electronics Application Engineer
SW

Stéphane WATTIAUX

WIRELEASE
CEO