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Mechatronics, Plastics, Printed Electronics & Smart Textiles: common origins for a common future ?
Conférence
11/26/2024
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09:15 - 09:45
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Salle de conférences
In recent decades, new terms have been added to the sometimes age-old professions of, for example, mechanics. One might think that adding a 'tronic' to the end of each word would make any object 'intelligent'. But is this a coincidence, a 'fashion'? Or are they disciplines with similar industrial origins and to what extent can they coexist in current and future developments? Through several examples, we will draw up the common points that link these technologies, what differentiates them and how they can be combined.
A new perspective on the plastronic functionalisation of 3D-printed composites and high-performance thermoplastic parts: from prototype to final part
Conférence
11/26/2024
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09:50 - 10:15
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Salle de conférences
Dimitri GERDIL
During recent years, electronic functionalization by plastronic process has been proven to be compatible with 3D substrates, either printed by Stereolithography (SLA) with photopolymers [1] or printed by Fused Deposition Modeling (FDM) with mostly low to medium performance materials like PLA or others [2]. Polymers used in SLA plastronic functionalization are limited in their thermal and mechanical properties. At the same time, FDM allows the use of High-Performance Polymers (HPPs) like PEI/Ultem or PEEK. These materials, while difficult to print correctly, have some of the best properties of the polymer family: high service temperatures (above 200°C for most of them), chemical stability, low flammability, good mechanical properties… Few studies have explored their potential for plastronic systems, even though they could open previously unreachable high-end applications like in the military sector or the aerospace industry.
Thus, in this presentation we aim to explain how we used an existing plastronic process (called P3DR) developed for SLA and adapt it for use on HPPs substrates printed by FDM. First, the substrate is printed carefully to minimize common issues with such materials. Then, the entire surface is covered with copper via an electroless metallization bath. This requires mechanical pretreatment and chemical activation but results in excellent conductivity compared to conductive inks. Once metallized, the electronic network is localized using a 6-axes laser alongside a protective mask and an acid attack. In the end, electric components can be soldered directly on the substrate thanks to its high service temperature, instead of using conductive glue.
This new process has been developed and tested with a composite filament made of polyamide and short carbon fibers called Onyx [3]. Printed parts can be further reinforced with continuous fibers (carbon, glass…) during the printing process, allowing their mechanical properties to reach close to that of the same part made in aluminum while weighting far less. Functionalizing HPPs substrates allows to create structural parts that are equipped with integrated sensors, antennas or LEDs, for example. To illustrate this possibility, we created a demonstrator consisting of an Onyx substrate equipped with mechanical strain sensors capable of relaying information about the force applied on a specific area. Furthermore, preliminary tests suggest that the process described is compatible with PEI/Ultem substrates, which are already in use in different sectors such as the aeronautical industry. This, along the potential functionalization of PEEK substrates, would allow plastronics to be used in previously unreachable applications.
Serving IoT manufacturing with printed electronics
Conférences flash
11/26/2024
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10:10 - 10:25
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MecaPlasTronic Lab
Laetitia FRIES
Isra is a French company renowned for its industrial expertise, particularly in the manufacture of smart cards. With more than 45 years' experience in graphic printing, Isra has developed complementary skills in the printing of printed circuits and antennas on flexible substrates, and in the dispensing of electronic components. Isra is now able to offer prototyping and industrial manufacturing services for printed electronic devices, several examples of which will be presented at this conference.
Flexible heater and smart substrate for industrial applications
Conférences flash
11/26/2024
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10:30 - 10:45
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MecaPlasTronic Lab
Maxime WAWRZYNIAK
Since many years, several industries have been working on various strategies to decrease carbon footprint of their products, which can lead in some cases to reduce weight (by using performant eco-friendly based materials), energy consumption, and optimize thermal management. Addev Materials has already launched several projects on this topic. This talk will present how its innovative films can play a key role in thermal management within several industrial fields, such as automotive, aerospace and general industries. Addev Materials has also developed flexible sensors to help monitoring thermal management through Bluetooth communication.
3D Electronics Enabled by Pad-printing of Conductive Inks
Conférences flash
11/26/2024
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11:50 - 12:05
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MecaPlasTronic Lab
Thibaut SOULESTIN
Henkel developed pad-printable electrically conductive silver inks for direct printing on 3D surfaces. To accelerate customer innovations, Henkel partners with Teca-Print, an expert company in pad-printing. 5G antenna application for smartphones will be showcased.
Research into smart textiles: between technical challenges and the creation of multifunctional materials
Conférence
11/26/2024
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11:55 - 12:20
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Salle de conférences
Thibault DORMOISClaire ELIOT
The field of intelligent textiles, and more specifically connected textiles, is booming thanks to the many possible applications in a variety of fields such as health, sport, industry and aeronautics. The aim of this paper is to present recent projects by the GEMTEX laboratory in the development of sensors, electrodes and antennae directly integrated into textiles. To achieve this, printing, embroidery and weaving techniques for conductive yarns and materials are used. The aim of this research into the manufacture of these different combinations of materials is to maintain the flexibility, comfort and versatility of textiles while adding significant value to complex structures. Numerous technical challenges are explored through the laboratory's various themes, including mechanical durability, the compatibility of different conductive materials and substrates, component integration and process optimisation.
Sensors, antennas and EMC: boost your innovations with the expertise of a Technology Resource Centre
Conférences flash
11/26/2024
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12:10 - 12:25
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MecaPlasTronic Lab
Elisabeth PATOUILLARD
CRESITT Industrie co-develops electronic technologies (sensors, signal processing, antennas, EMC, etc.) with companies, optimising their systems and ensuring that they comply with CE marking. We also help you to develop your skills, thereby enhancing your mastery of these technologies and your capacity for innovation.
Smart textile, combining product innovation and consumer/user/customer expectations, a challenge taken up by Eweave
Conférence
11/26/2024
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12:25 - 12:50
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Salle de conférences
Valentin DÉCAROUXDelphine VIALLETON
2022 : Launch of Eweave, a pioneering brand in the field of smart textiles. Our products offer flexible linear geolocation solutions, as well as power and data transfer, and flexible, robust textile lighting solutions. Discover, through concrete examples, how a smart textile ribbon can become an innovative, differentiating tool for industrial players.
Printed electronics and the automotive industry: benefits, use cases and technological challenges
Conférences flash
11/26/2024
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12:30 - 12:45
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MecaPlasTronic Lab
Damien BOUISSET
We will present the use cases for printed electronics envisaged in the automotive industry, particularly in vehicle interiors, explaining the advantages we see at Forvia, how this fits in with market dynamics and the technological challenges to be overcome.
3DFLAXTRONICS: intelligent, sustainable composite materials based on flax organosheets
Conférences flash
11/26/2024
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14:05 - 14:20
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MecaPlasTronic Lab
Christian WEISSE
Production of printed circuits based on copper metal deposited on fibreglass and biosourced fabrics for integration into composite materials. The organosheets provide the antenna, heating, sensor or wiring functions. They are then directly thermoformed or injected to form intelligent 3D objects based on biosourced materials.
CircEl-Paper, Circular Materials for Sustainable Electronics : How can circular materials meet the technical requirements of printed circuit boards?
Conférence
11/26/2024
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14:05 - 14:15
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Salle de conférences
Valerio BENI
The EU-funded project CircEl-Paper is heading to close the loop for circular economy for reliable PCB: by using paper and paper recycling processes, by exploiting secondary raw materials, by using biobased materials and by cost and material efficient printing processes. The project team will present first results on new paper and ink formulations, on paper-based PCB manufacture and on the adaptation of paper recycling processing to recover PCB materials.
A unique process for forming IME parts or functional films: PLASTITRONIC® technology
Conférences flash
11/26/2024
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14:25 - 14:40
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MecaPlasTronic Lab
Vincent DONIER
New fields of application for the automotive and aerospace markets: new high-performance materials, new on-board functions, new decorative designs.
Optimising production with customised mechatronic tools: simplicity and performance
Conférences flash
11/26/2024
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14:45 - 15:00
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MecaPlasTronic Lab
Alexandre QUARREY
Improving production, quality and efficiency with tailor-made mechatronic solutions doesn't have to be complicated. This conference explores practical methods and accessible technologies for developing tailored mechatronic tools, enabling rapid integration and optimisation of your industrial processes.
Polytronics: your one-stop shop for financing your digital transformation and making it a success
Conférences flash
11/26/2024
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15:05 - 15:20
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MecaPlasTronic Lab
Julie MALAQUIN
Polytronics: accelerating your digital transformation through innovation, prototyping, training and collaboration services.
The challenges of the LDS process for RF applications, from consumer applications to metasurfaces
Conférence
11/27/2024
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09:00 - 09:25
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Salle de conférences
Abdel-Hadi HOBBALLAH
Antennas are all around us. New communication standards, new norms and the omnipresence of these antennae mean that they have to be designed and integrated in ever more complex ways. Plastronics technologies are the perfect answer to these challenges. We will see how LDS technology is suited to the production of all types of antenna, from the most standard to the most complex, thanks in particular to the variety of materials, their thermomechanical properties and dielectric characteristics. Numerous examples will be given, covering all market sectors, from the most general public to the most demanding.
How to miniaturize antennas with metamaterials?
Conférence
11/27/2024
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09:30 - 09:55
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Salle de conférences
Delphine BECHEVET
In this talk we will present how metamaterials can be used to miniaturize antennas in UHF and SHF bands. First we will explore electronics and cavity models to analyse antennas then we will focuse on metamaterials called CRLH-m (Composit Right Left Handed - materials), then we will present some results and discuss on them.
Printed electronics for sensors: explore the potential of piezoelectric polymers
Conférences flash
11/27/2024
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10:30 - 10:45
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MecaPlasTronic Lab
Mickaël PRUVOST
Dive into a new era of possibilities thanks to Arkema's electroactive polymers through a range of products in the form of powders, inks and films specially designed for the printed electronics markets. Whether you are a printer, integrator or end-user, electroactive polymers will help you innovate and add a touch of sensitivity to your electronics. By enriching the primary qualities of polymers, such as their ability to be printed, their mechanical flexibility and the freedom to shape them, electroactive polymers add sensitivity to your devices by exploiting their piezoelectric properties (Piezotech® FC). These polymers can transform vibrations, impacts and deformations into electrical signals, laying the foundations for highly sensitive sensors over a wide frequency band. Their integration makes it possible to meet a range of challenges in fields such as the automotive industry (secured HMI), structural control (acoustic emission for hydrogen tanks, batteries, etc.), healthcare (capture of vital signals), acoustics (pickup for musical instruments), sport (shock sensors), etc. In this presentation, we will present the technology of piezoelectric polymers and how to implement and use them, focusing on concrete integration cases for different markets (medical, automotive, industry, etc.).
Programmable metasurfaces based on phase-change materials
Conférence
11/27/2024
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11:05 - 11:30
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Salle de conférences
Sébastien CUEFF
We experimentally demonstrate programmable nanophotonic devices based on phase-change materials (PCMs). More specifically, we propose and demonstrate multi-level tunability approaches exploiting various PCMs such as VO2, GST and Sb2S3, hybridly integrated in programmable photonic components.
Light ultra-low MRI: opportunities and challenges for the development of a new generation of devices
Conférence
11/27/2024
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11:35 - 12:00
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Salle de conférences
Redha ABDEDDAIM
In the coming years, the advent of ultra-low field MRI will make it possible to bring MRI technology directly to the patient via on-board mobile devices. At this conference, I will present the challenges facing these new technologies and the opportunities they offer, particularly in the field of electronics.
Recyclable electronics for the circular economy
Conférences flash
11/27/2024
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12:10 - 12:25
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MecaPlasTronic Lab
Nicolas FUMEAUX
In 2023, over 62 million tons of electronic waste were generated, but less than 20% underwent recycling, and solutions to tackle this issue are urgently needed. At Circelec, we specialize in fabricating additively manufactured circuit boards from recyclable and compostable materials. By harnessing printing technology, we minimize material wastage and seamlessly integrate with standard industrial production lines. These boards cater to a diverse array of growing markets, including RFID, smart packaging, and consumer electronics.
Recyclable Smart labels on Paper substrate
Conférences flash
11/27/2024
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12:30 - 12:45
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MecaPlasTronic Lab
Victor THENOTJuliette SEIGNARD
Fedrigoni will present how they bring more intelligence to paper substrate by embedding Printed Electronics devices such as NFC and RFID antennas, electrochromic displays, sensors, and batteries while still keeping recyclability of the product. Fedrigoni worked intensively to develop printed electronics additive manufacturing technology on paper substrate through several years of research as well as collaborative projects in various European consortiums. A particular focus will be made on Fedrigoni ecoconception approach through life cycle analysis and recyclability assessment of their products. Finally, by upgrading an industrial flexo printing machine, Fedrigoni is now able to manufacture recyclable smart labels and smart packaging for large volumes at competitive costs.
Design of medical patches for biosignal measurement with soft, stretchable and adhesive material
Conférences flash
11/27/2024
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14:05 - 14:20
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MecaPlasTronic Lab
Tewfik KASDI
The demand for medical patches that allow at-home patient monitoring is rapidly increasing, as they help reduce hospitalizations, lower healthcare costs, and offer greater freedom to users. This presentation will explore key considerations in the design of medical patches, emphasizing the importance of selecting comfortable, skin-safe materials tailored to specific applications. We will discuss existing and emerging solutions, including soft skin-conductive adhesives for ECG, EMG, or EEG electrodes, stretchable materials for signal transmission, self-regulating heating elements, temperature-sensitive materials, and silicon membranes and resins for encapsulation. These advancements are paving the way for more efficient, user-friendly healthcare technologies.
Printed transient electronics: enhancing sustainability of disposable sensing systems
Conférence
11/27/2024
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14:10 - 14:35
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Salle de conférences
Danick BRIAND
With a projected doubling of the number of Internet-of-Things products by 2030, developing environmentally friendly and non-toxic electronics and sensing alternatives would be an impactful solution to the growing electronic waste issue. Research is required to fully exploit printed electronics capabilities to reach more sustainable electronic and sensing systems, targeting a higher level of circularity. Additive manufacturing of eco-friendly and renewable materials is a promising approach for the development of more sustainable electronic systems by enabling, after service life, their ecoresorbability and/or recyclability.
State of standardization of 3D Plastronics and Printed Electronics
Conférences flash
11/27/2024
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14:45 - 15:00
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MecaPlasTronic Lab
Francisco FOURCADE
Provides an update on recently released standards for 3D Plastronics and Printed Electronics as IPC, together with industry, responds to a rapidly growing market. IPC standards are industry consensus documents developed by industry for industry, tailored to address challenges and reliability aspects in design, qualification, manufacturing processes and acceptance.
Electronic decals : a revolution in the integration of printed electronics into complex substrates
Conférences flash
11/27/2024
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15:05 - 15:20
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MecaPlasTronic Lab
Fanny ROUMET
Just like transferring a pattern onto fabric, it is now possible to transfer circuits onto any type of object. Thanks to electronic decals, printed circuit boards can be transferred onto complex surfaces of all kinds, whether flat or curved.
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